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 |
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 |
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Subcon |
|
Material |
|
Vender |
|
Report date |
|
Expire date |
|
ICP_1 |
|
ICP_2 |
|
|
|
CHIPMOS |
|
Epoxy |
|
YIZTECH |
|
2010-03-18 |
|
2011-03-18 |
|
 |
|
|
|
|
|
CHIPMOS |
|
Epoxy |
|
HENKEL |
|
2009-11-17 |
|
2010-11-17 |
|
|
|
|
|
|
|
CHIPMOS |
|
Epoxy |
|
HENKEL |
|
2009-11-20 |
|
2010-11-20 |
|
|
|
|
|
|
|
CHIPMOS |
|
Gole wire |
|
SUMITOMO |
|
2009-12-03 |
|
2010-12-03 |
|
|
|
|
|
|
|
CHIPMOS |
|
Gole wire |
|
TANAKA |
|
2009-12-18 |
|
2010-12-18 |
|
|
|
|
|
|
|
CHIPMOS |
|
Lead frame |
|
FUSHENG |
|
2010-03-05 |
|
2011-03-05 |
|
|
|
|
|
|
|
CHIPMOS |
|
Lead frame |
|
SAMSUNG |
|
2009-09-01 |
|
2010-09-01 |
|
|
|
|
|
|
|
CHIPMOS |
|
Lead frame |
|
SUMITOMO |
|
2009-12-22 |
|
2010-12-22 |
|
|
|
|
|
|
|
CHIPMOS |
|
Mold compound |
|
HITACHI |
|
2010-04-30 |
|
2011-04-30 |
|
|
|
|
|
|
|
CHIPMOS |
|
Mold compound |
|
HITACHI |
|
2010-04-30 |
|
2011-04-30 |
|
|
|
|
|
|
|
CHIPMOS |
|
Mold compound |
|
SHINETSU |
|
2009-08-19 |
|
2010-08-19 |
|
|
|
|
|
|
|
CHIPMOS |
|
Solder Ball |
|
SENJU |
|
2010-01-20 |
|
2011-01-20 |
|
|
|
|
|
|
|
CHIPMOS |
|
Tin Plating |
|
YUNNAN |
|
2010-02-28 |
|
2011-02-28 |
|
|
|
|
|
|
|
CHIPMOS |
|
Tray |
|
CHIPMOS |
|
2010-01-28 |
|
2011-01-28 |
|
|
|
|
|
|
|
DBH |
|
Wafer |
|
DBH |
|
2010-03-08 |
|
2011-03-08 |
|
|
|
|
|
|
|
SIGNETICS |
|
Epoxy |
|
ABLESTIC |
|
2009-11-17 |
|
2010-11-17 |
|
|
|
|
|
|
|
SIGNETICS |
|
Gole wire |
|
HERAEUS |
|
2009-07-08 |
|
2010-07-08 |
|
|
|
|
|
|
|
SIGNETICS |
|
Mold compound |
|
SUMITOMO |
|
2010-07-14 |
|
2011-07-14 |
|
|
|
|
|
|
|
SIGNETICS |
|
Solder Ball |
|
KOJIMA |
|
2009-10-30 |
|
2010-10-30 |
|
|
|
|
|
|
|
SIGNETICS |
|
Substrate |
|
LG INNOEK |
|
2010-06-04 |
|
2011-06-04 |
|
|
|
|
|
|
|
SIGNETICS |
|
Substrate |
|
LG INNOEK |
|
2009-12-21 |
|
2009-12-21 |
|
|
|
|
|
|
|
SIGNETICS |
|
Tray |
|
SUNRISE |
|
2009-11-17 |
|
2010-11-17 |
|
|
|
|
|
|
|
WATON |
|
Epoxy |
|
FEEDPOOL |
|
2009-09-16 |
|
2010-09-16 |
|
|
|
|
|
|
|
WATON |
|
Epoxy |
|
FEEDPOOL |
|
2009-05-14 |
|
2010-05-14 |
|
|
|
|
|
|
|
WATON |
|
Epoxy |
|
HENKEL |
|
2009-11-17 |
|
2010-11-17 |
|
|
|
|
|
|
|
WATON |
|
Gole wire |
|
MKE |
|
2009-12-24 |
|
2010-12-24 |
|
|
|
|
|
|
|
WATON |
|
Gole wire |
|
YCMC |
|
2010-03-11 |
|
2011-03-11 |
|
|
|
|
|
|
|
WATON |
|
Lead frame |
|
FUSHENG |
|
2010-03-05 |
|
2011-03-05 |
|
|
|
|
|
|
|
WATON |
|
Mold compound |
|
SUMITOMO |
|
2010-06-29 |
|
2011-06-29 |
|
|
|
|
|
|
|
WATON |
|
Mold compound |
|
HITACHI |
|
2010-04-30 |
|
2011-04-30 |
|
|
|
|
|
|
|
WATON |
|
Mold compound |
|
SUMITOMO |
|
2010-01-20 |
|
2011-01-20 |
|
|
|
|
|
|
|
WATON |
|
Solder Ball |
|
SENJU |
|
2010-01-20 |
|
2011-01-20 |
|
|
|
|
|
|
|
WATON |
|
Substrate |
|
SUBTRON |
|
2010-05-18 |
|
2011-05-18 |
|
|
|
|
|
|
|
WATON |
|
Tin Plating |
|
JAUJANQ |
|
2010-06-21 |
|
2011-06-21 |
|
|
|
|
|
|
|
WATON |
|
Tin Plating |
|
JAUJANQ |
|
2009-10-23 |
|
2010-10-23 |
|
|
|
|
|
|
|
WATON |
|
Tray |
|
SUNRISE |
|
2009-11-26 |
|
2010-11-26 |
|
|
|
|
|
|
|
WEC |
|
Wafer |
|
WEC |
|
2009-12-28 |
|
2010-12-28 |
|
|
|
|
|
|
 |
|
 |
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